Description
VMIVME-7807 VMIVME-017807-413000 350-0001007807-413000 D Solderless pressure contact point modules
VMIVME-7807 VMIVME-017807-413000 350-0001007807-413000 D has its own connection to the main terminals, the current distribution between the paralleled chips is very homogeneous and the package resistance RCC’+EE’ is small. The large area connection between the DBC substrate and the heat sink is not soldered and the substrate can be ‘moved’ around the heat sink almost without restriction, depending on the temperature cycling reliability.
Aluminium Silicon Carbide (AlSiC) is not suitable for copper substrates due to cost and high power density requirements, as well as relatively poor thermal performance.VMIVME-7807 VMIVME-017807-413000 350-0001007807-413000 The D-System completely eliminates the need for a large soldered connection, and replaces it with a pressurised connection. Currently, the SKiiP technology has been further improved for the new SKiM automotive module concept to ensure efficient, reliable and durable modules.SKiM is designed to meet the stringent requirements of high power densities and harsh environmental conditions in automotive applications.
VMIVME-7807 VMIVME-017807-413000 350-0001007807-413000 The circuits of the D-module series are six-package devices with three independent half-bridges. Each half-bridge has its own DC terminal and incorporates a negative temperature coefficient (NTC) temperature sensor. The auxiliary contacts for controlling the IGBTs are solderless spring-loaded connections. the IGBT drivers can be mounted on top of the module for electrical connection. Because of the same height, both 17 mm, the DC and AC terminals have the same DC terminal position and construction principle, which makes the module an optimal choice for modular designs at different current levels.
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