TRICONEX 3006 High Speed Servers

3006

Technical Parameters:

  • Full lineup of 36 discrete, analog and specialty PAC I/O modules
  • Local, Expansion and Remote I/O bases, up to 115,000+ I/O points
  • Auto-discover local and remote PAC bases, I/O and GS drives
  • Hot-swappable I/O, No module placement restrictions, No power budget limitations
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Simon Zhang
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Description

TRICONEX 3006 High Speed Servers


The 3006 buffer for VME, CompactPCI and PCI stores captured data prior to processing by the FPGA. The data is directly accessible through the FPGA. The data is then moved to 2M x 72-bit SRAM for high-speed DMA transfer to the bus or CPU. a high-bandwidth serial x4/x8 interface ensures fast data throughput. 16M x 16-bit parallel flash memory provides easy storage of MicroBlaze program code. many IP carriers are available. A number of IP carriers are available. the IOS module plugs into a carrier card, which slides directly into the I/O Server Industrial PC.

The 3006’s servers use advanced heat sink technology and conduction cooling to manage overheating within the fanless computer. To simplify software development Acromag offers a variety of programmer support tools. Buffers store captured data before it is processed by the FPGA. The data is directly accessible through the FPGA. The data is then moved to 2M x 72-bit SRAM for high-speed DMA transfer to the bus or CPU. a high-bandwidth serial x4/x8 interface ensures fast data throughput. 16M x 16-bit parallel flash memory provides convenient storage for MicroBlaze program code.