SD822 3BSC610038R1 Hybrid Firmware Chip

The SD822 3BSC610038R1 hybrid stack is based on the G3-plc, IEEE802.15.4, 6 Lopan and IPV6 open standards. By embedding support for RF mesh in the physical and data link layers, the ST8500 combines the advantages of powerline and wireless mesh networks for communication between smart nodes and data collectors. Unlike simple point-to-point links, the hybrid mesh interconnect nodes extensively improve reliability, enhance fault-tolerant connectivity, and extend communication distances. Its hardware development kit handles PLC and RF connections and applications.

The module consists of two evaluation boards targeting the 868 MHZ and 515 MHZ unlicensed RF bands with documented firmware to help users quickly build and test nodes compliant with the G3-plc Mixer, the industry’s first published standard for PLC and RF connectivity.
In addition, its intelligent computer application provides a state-of-the-art platform with more memory, greater capacity, and more communication ports, essentially replacing the Allen-Bradley pc-5, SLc-500, PLc-2, PLc-3, and even the 1774 PLC. these migration kits are the simplest and lowest-cost option for Allen-Bradley users a path forward with little downtime or staff training.

Users can upgrade the module without the need for reprogramming or rewiring.The SD822 3BSC610038R1 kit includes.
CPUs that connect directly to existing A-BI/Os
Service to convert existing ladder logic and programme documentation to the new CPU format
Programming/maintenance software