Description
LXN1604-6 3BHL000986P7000 Fast Data Exchange Devices
The LXN1604-6 3BHL000986P7000 is designed for fast data exchange at the field level, where a central programme controller (e.g. PLC, PC or process control system) communicates with decentralised field devices (e.g. I/Os, drives, valves or transmitters) via a fast serial connection. Based on the specific needs of various application areas, the basic functionality of the DP has been progressively extended with special features, and is currently available in three versions: DP-V0, DP-V1 and DP-V2, each of which has its own dedicated key features, as shown in Figure 1. This distinction between the versions reflects the chronological order in which the specification work has been completed in response to growing application requirements.
LXN1604-6 3BHL000986P7000 is an open standard and, in principle, the protocol can be implemented on any processor. Currently, automation manufacturers develop PROFIBUS-DP master devices with the LXN1604-6 3BHL000986P7000 equipped with a soft PROFIBUS master, a solution that implements the PROFIBUS protocol entirely in software, with the microprocessor running the complete protocol stack. This solution is particularly difficult and risky to develop, and has a long development cycle, and requires developers to be particularly familiar with PROFIBUS protocols and frameworks. After the product is developed, it needs to be sent to Europe for protocol conformance testing and certification.
LXN1604-6 3BHL000986P7000 dedicated ASIC chip plus the expansion of the curing process Firmware, the programme is the use of more of a special ASIC chip to achieve the PROFIBUS protocol data link layer media access control functions; while the other functions of the data link layer and the application layer by the microprocessor to run its expansion of the curing process. Programmes are implemented by the microprocessor running its extended curing procedures. However, the current domestic market is difficult to buy Firmware, if the user writes its own Firmware is more difficult, the development cycle is also long, the same need to be sent to Europe for protocol conformance testing and certification.