IMHSS03 Requirements for the production and processing of high precision requirements, in modern daily life, many daily electronic products are particularly fast, used in the development of research and production cycle is particularly short, and in this link, the production link is particularly important, so on the production equipment requirements are also increasingly high, the production equipment should be able to adapt to a variety of different products, especially new products production The production equipment should be able to adapt to the production of a variety of different products, especially new products, and also be able to ensure the accuracy of the products.

IMHSS03 in the TFT production, in the substrate to complete the circuit printing and a series of work after a process, is the substrate cutting, because in the former production according to the requirements of the equipment and process is a relatively large substrate, in a large substrate may be composed of a number of small substrate, which is based on the manufacture of the panel itself to determine the purpose. Such as mobile phone panels, currently in the production of a large substrate has 30 to 104 pieces of small substrate composition, which is also based on the size of the mobile phone panel to determine.

IMHSS03 after cutting, into a piece of a small substrate, you can see, the substrate by the combination of two layers of glass, between the two layers of printed circuits, and in the cutting of the upper and lower is not in a line, but into a ladder, in the TFT surface of the A in the printed circuit terminals, cut off the process can not hurt the terminals.A-F in the five dimensions of the accuracy to reach ± 0.1mm, and after cutting the substrate in the substrate, the accuracy of the cut-off process can not be hurt. The dimensional accuracy of all 5 dimensions in A-F should reach ±0.1mm, and there should be no burrs on the edge of the substrate after cutting.