GDC806A0101 3BHE028761R0101 High Speed Proficient Positioning System

GDC806A0101 3BHE028761R0101 requirements for the production and processing of high precision requirements, in modern daily life, many daily electronic products are particularly fast, used in the development of research and development, production cycle is particularly short, and in this link, the production link is particularly important, so on the requirements of the production equipment is also more and more high, production equipment to be able to adapt to the production of a variety of different products, especially the ability to adapt to the production of new products, but also to ensure product accuracy. The production equipment should be able to adapt to the production of a variety of different products, especially the production of new products to adapt to the ability, but also to ensure the accuracy of the product.

GDC806A0101 3BHE028761R0101 in the TFT production, in the substrate to complete the circuit printing and a series of other work after a process, is the substrate cutting, because in the former production according to the requirements of the equipment and process is a relatively large substrate, in a large substrate may be composed of a number of small substrate, which is based on the manufacture of the panel itself, the use of the panel to determine. Such as mobile phone panels, currently in the production of a large substrate has 30 to 104 pieces of small substrate composition, which is also based on the size of the mobile phone panel to determine.

GDC806A0101 3BHE028761R0101 after cutting, into a piece of a small substrate, as shown in Figure 2. GDC806A0101 3BHE028761R0101 can be seen, the substrate consists of a combination of two layers of glass, there are printed circuits between the two layers, and the top and bottom of the cut is not in a line, but into a ladder shape In the TFT surface of the printed circuit terminals at A, cut off the process must not touch the terminals. A-F in the five dimensions of the accuracy to reach ± 0.1mm, and cut off after the edge of the substrate can not have burrs