DSCA190V 57310001-PK Communication Module (复制)

DSCA190V 57310001-PK Communication Module 

The DSCA190V 57310001-PK has two types of ruggedised edge AIoT platforms available for next-level workload integration capabilities in different vertical markets. iEPF-9000S series Expendable Edge AIoT platforms have flexible configurations and expansion slots for a variety of expansion cards; and the iEP-9000E series Compact Edge AIoT platforms feature a passive cooling solution for a space-saving, fanless design. Both systems are powered by Intel® 10th Generation Xeon® W and Core i7/i5/i3 processors (Comet Lake) with W480E, Q470E, and H420E chipsets, providing superb compute power, and supporting a total of 4 DDR4 SO-DIMM slots of up to 128GB, a significant upgrade in memory size that is ideal for edge Artificial Intelligence applications.

The DSCA190V 57310001-PK is rich in industry-centric I/O and flexible expansion for easy integration. Supports up to 5 Intel Gigabit LANs, 2 of which support PoE for reliable connectivity, 4 USB 3.2 Gen2, 3 USB2.0, 6 COMs (4 RS-232/422/485, 2 RS-232), 8 DI/DOs (2.5KV isolation support), and up to 5 I/Os via triple displays with 2 display ports and 1 VGA. monitors, and 4 SATA3 with hot-swappable trays for 2.5-inch SSDs or HDDs (CFast option). iEPF-9000S series is designed with flexible expansion slots supporting 1 PCIe x16 (Gen 3) or 2 PCIe x8 (Gen 3), and 2 PCIe x4 for various expansion cards, such as graphics cards, image capture cards, and other cards. such as graphics cards, image capture cards, motion cards, and IO cards. In addition, there are various RF modules and storage sockets, 1 M.2 Key M for NVMe / SATA SSD, 1 M.2 Key B for 4G / 5G, 1 M.2 Key E for Wi-Fi / BT, and two Mini PCIe for optional modules.