BENTLY 1900/65A-00-00-01-00-01 High Performance Measurement Module

BENTLY 1900/65A-00-00-01-00-01

Technical Parameters:

  • Full lineup of 36 discrete, analog and specialty PAC I/O modules
  • Local, Expansion and Remote I/O bases, up to 115,000+ I/O points
  • Auto-discover local and remote PAC bases, I/O and GS drives
  • Hot-swappable I/O, No module placement restrictions, No power budget limitations
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Description

BENTLY 1900/65A-00-00-01-00-01 High Performance Measurement Module


The BENTLY 1900/65A-00-00-01-00-01 module measures currents and voltages up to the 31st harmonic and is therefore very accurate. Due to its high sensitivity and fourth channel, it is ideally suited for measuring leakage currents on the neutral line. The signals are pre-processed before being passed on as digital variables, thus reducing the load on the controller. Reactive and apparent power are measured for each of the three phases, as well as the total reactive and apparent power of the three phases. The power consumption and sum of each phase is also recorded. The module measures currents and voltages up to the 31st harmonic and is therefore very accurate. Due to its high sensitivity and fourth channel, it is ideally suited for measuring leakage currents on the neutral line.

The BENTLY 1900/65A-00-00-01-00-01 can have 4,096 crossings. The matrices are available in 2-, 4-, or 8-slot PXI sizes and are designed to meet high-performance matrix requirements. With their switching density, these PXI matrices allow a full-featured ATE system to be housed in a single 3U PXI chassis and allow the use of 8- or 14-slot PXI chassis. The matrices feature a built-in shielded analog bus design to minimize the complexity of cable assemblies for the device under test and instrumentation. The series includes Pickering’s built-in relay self-test (BIRST) and also supports its eBIRST switching system test tools. These tools provide a way to find relay faults within the module.

The BENTLY 1900/65A-00-00-01-00-01 matrix can be used in many industries; however, typical applications include automotive ECU and semiconductor package testing. The dual analog buses of the narrower matrix option allow for completely separate matrices within a single module for parallel testing. The module provides a simple interface to the host controller via SPI. The module interfaces to a variety of MCU/CPU platforms and ensures reliability, resilience, scalability, power flexibility and ease of use. At the heart of the technology is Intelligent Mesh Networking, which features advanced algorithms and energy-efficient technologies that enable powerful features not available from other WSN providers. These features include deterministic power management and optimization, automatic mesh network formation and self-healing techniques, zero-collision low-power packet switching, and scalability to large, dense, deep networks.