1C31122G01 Power Drive System

1C31122G01

D2-08ND3 – 8 pt. 12-24 VDC current sinking/sourcing, 1 common (2 common terminals), removable terminal

 

D2-08TD1 – 8 pt. 12-24 VDC current sinking output module, 1 common (2 common terminals), 0.3A/point, 2.4A/module, fused per common (non-replaceable), removable terminal

twork communication (Unicom, Telecom, Mobile)

Support low power consumption mode

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Description

1C31122G01 Power Drive System


1C31122G01 module has two modes in use, one is the format transmission mode. The other is transparent transmission mode. Module transmission format can not be transparent and G200-type GPRS module and transparent transmission mode? In fact, the transparent transmission mode of the serial port and the serial port of the device to transmit data although no format, but the destination address of the data is implicitly specified. The destination address of the data is saved in the EEROM, which is read into the ROM after the module is powered up, and the module turns the unformatted data of the serial port into formatted data containing the destination address when sending data.

The destination address in the 1C31122G01 will change in two situations, one situation is to use the destination address change instruction to change the destination address in the EEROM. In the other case, the module compares the original address of the received data with the destination address in ROM when the data is received electrically, and replaces the destination address in ROM with the source address of the received data if the two addresses are different.

The destination address of the 1C31122G01 will change in two situations, one situation is to use the destination address change instruction to change the destination address in the EEROM. In the other case, the module compares the original address of the received data with the destination address in ROM when the data is received electrically, and replaces the destination address in ROM with the source address of the received data if the two addresses are different. Due to solder fatigue, the power cycling capability of soldered power modules with backplanes decreases dramatically at higher operating temperatures. Matching the coefficients of thermal expansion (CTE) of various materials to each other and advanced packaging and bonding techniques become the key to success.