12P3439X012 KJ2003X1-BB1 Solderless pressure contact point modules

12P3439X012 KJ2003X1-BB1 has its own connection to the main terminals, the current distribution between the parallel chips is very even and the package resistance RCC’+EE’ is small. the large connection between the DBC substrate and the heat sink is not soldered, and depending on the reliability of the temperature cycling the substrate can be “moved” almost without restriction on the heat sink. The large area connection between the DBC substrate and the heat sink is not soldered, and the substrate can be ‘moved’ around the heat sink almost without restriction, depending on the temperature cycling reliability.

Aluminium Silicon Carbide (AlSiC) is not suitable for copper substrates due to cost and high power density requirements and relatively poor thermal performance.12P3439X012 KJ2003X1-BB1 developed SKiiP technology, a bottomless crimp system, over 15 years ago. This system completely eliminates large solder connections and replaces them with pressure connections. Currently, the SKiiP technology has been further improved for the new SKiM automotive module concept to ensure efficient, reliable and durable modules.SKiM is designed to meet the stringent requirements of high power densities and harsh environmental conditions in automotive applications.

The circuits of the 12P3439X012 KJ2003X1-BB1 module family are six-package devices with three independent half-bridges. Each half-bridge has its own DC terminal and incorporates a negative temperature coefficient (NTC) temperature sensor. The auxiliary contacts for controlling the IGBTs are solderless spring-loaded connections. the IGBT drivers can be mounted on top of the module for electrical connection. Because of the same height, both 17 mm, the DC and AC terminals have the same DC terminal position and construction principle, which makes the module an optimal choice for modular designs at different current levels.