086349-002 module standard specification. This standard is urgently needed because all new IoT/5G connected devices require high bandwidth, high frequency communication buses that COM Express inter-board connectors cannot support. This means that the standard specification for embedded computer modules, which has been conceived and implemented globally for decades, will be developed by the same German COM consortium. Currently, the main driving force behind this alliance is the German company Conquest, which was founded in 2005 as a pure computer module supplier to avoid competing with its own customers in the system solutions market. The company also conceived Qseven and SMARC 2.0.

086349-002 As the industry gradually switches from ETX to COM Express, the introduction of new bus technologies naturally ushers in new standards. the COM-HPC standard specification is intended to set a new standard for embedded computer modules for broadband computing in broadband networks that are suitable for PCI Express Generation 3 to Generation 5 high-frequency signals. However, just as COM Express did not replace ETX, COM-HPC should not be a replacement for COM Express. As I mentioned earlier, ETX/XTX modules are still available today, and users will still be able to use the same design principles even 20 years from now.

086349-002 in the COM-HPC module standard also ensures that the basic concepts that worked in the past are still valid today. In addition, new processor designs are more complex and therefore require more I/O to be exported from the CPU module via specific carrier boards. 086349-002 is not just about new connectors, but also about the fact that many of the features in the legacy COM Express are no longer needed and need to be removed. This is due to the fact that the new standard is targeting applications in a more demanding way, well beyond the performance support of current top-of-the-line COM Express.