216DB61 HESG324063R100/J Multi-Core Processor

216DB61 HESG324063R100/J

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Description

216DB61 HESG324063R100/J Multi-Core Processor


The 216EA62 1MRB150083R1/F computer module, based on the NXP i-MX 8M Nano processor, is aimed at low-power and cost-effective graphical interface applications, as well as industrial headless (headless) manipulation systems, including the IEEE 1588 Precision Time Protocol in the touch-enabled Industrial Internet of Things. Up to 4GB of low-power LPDDR4 and up to 128GB of eMMC 5.1 non-volatile memory ensure the module’s large storage capacity.

The 216EA62 1MRB150083R1/F features quad-core, dual-core, and single-core ARM Cortex-A53 processors. Each model is complemented by a Cortex-M7 processor and supports extended (0°C to 60°C) and industrial (-40°C to 85°C) temperature ranges. Part of the processor, the integrated GC7000UltraLite 3D GPU with support for 2X shaders and OpenGL, OpenCL, Vulkan. embedded displays can be connected via dual-channel LVDS, eDP or MIPI-DSI.

The 216DB61 HESG324063R100/J’s I/O features include multiple USB 3.1 and USB 2.0 ports, eight PCI Express x1 Gen 3 lanes, two SATA 6Gb/s ports, and a Gigabit Ethernet interface. With its wide voltage input range from 5V to 20V, it offers a more flexible implementation without the need for additional voltage conversion circuitry. It also supports TPM 2.0 to provide enhanced security for flexible embedded systems.