IS200ISBBG2AAB Rackmount Power Boards

IS200ISBBG2AAB Rackmount Power Boards

IS200ISBBG2AAB High-temperature diffusion/oxidation system is mainly composed of diffusion furnace, purification workbench, push-pull boat system, and gas source cabinet. Semiconductor equipment production process diffusion / oxidation process is: the temperature of the diffusion furnace according to a certain temperature process to a specific temperature, and to ensure that the furnace is at a constant temperature. The operator will be placed on the push-pull boat tray to diffuse the wafer through the push-pull device into the diffusion furnace.

IS200ISBBG2AAB diffusion furnace to maintain a specific constant temperature conditions, the diffusion furnace to inject a variety of gases to be mixed. The whole process to ensure that the participation in the furnace body to form a specific constant temperature zone, in order to make the wafer diffusion uniform. So the temperature control is the most important part of the diffusion process control system, the control effect directly determines the quality of semiconductor diffusion.

IS200ISBBG2AAB According to the requirements of semiconductor diffusion/oxidation process, that is, both to realize the whole process control process automation and semiconductor diffusion/oxidation process requirements. System to PLC as the core, LCD touch screen for the human-computer interface, the use of self-developed JC-9 temperature detection module to achieve the collection of temperature and so on. System hardware structure is shown in Figure 1.